现货LOTES LGA 2011-0/1/3/4 X79 X99 CPU芯座

Application:

?9?9  Server

Features:

?9?9       SolderBall, SMT Soldering

?9?9       Approved byIntel

Specification:

Mechanical:

?9?9       Pitch:0.508 (X)脳0.8814mm (Y)

?9?9       Contact Count:2011Pin

?9?9       Durability:30 Cycles

  Electrical:

?9?9       CurrentRating: Min.0.5A / Pin

?9?9       Contact Resistance: Max. 22m惟(Initial & Final)

   Physical:

?9?9       Housing:Thermoplastic, black,

?9?9       Cover Cap: Thermoplastic, black

?9?9       Contact:High-strength copper alloy

          Plating: Min. 30u鈥� nickel under plated over all;

                              selective gold plated on contact area;

                              Matte-tin on solder tail

?9?9Lever: Stainless steel

?9?9Force Frame and Stiffener Frame:Stainless steel                              

?9?9        Solder Ball:Sn/Ag/Cu alloy for lead-free type

?9?9OperatingTemperature:-25鈩儈105鈩�

    Packaging:

?9?9       HardTray