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用途范围CP6920F/CP6920F3

CP6920F/CP6920F3

Anisotropic Conductive Film (ACF) for Chip On Glass for small-to-medium-sized LCDs

Suitable for direct mounting of driver IC which drives a flat panel display onto glass substrate.
With both excellent conductivity and insulating property between terminals for fine pitch connection.

Anisotropic Conductive Film (ACF)

 

 

Please select the product name :

 

CP6920F/CP6920F3

CP30941-20AB

 

 

 

CP6920F/CP6920F3

 

For small-to-medium-sized LCDs

 

AV/

Game machines/

Cellular phones/

Automobiles

 

 

Our unique insulating coating technology on a conductive particle takes optimum conductivity in vertical while it completely insulates in horizontal.

With an optimum thermal compression, it is possible to interconnect a large number of bumps with fine pitch at a time.

High reliability by excellent Anti-migration feature.

The 2 layer structure of ACF accommodates adhesive layer and non-conductive layer which efficiently trap conductive particles and compatible for fine pitch application.

 

 

 

 

 

 

Product Name

CP6920F

CP6920F3

Type

COG

COG

Connection material

IC

IC

ITO Glass

ITO Glass

Minimum space (μm) *1

15

12

Minimum pitch (μm) *2

-

-

Minimum connection area (μm2) *3

1800

1300

Thickness (μm)

20

20

Conductive particles

Type

Au/Ni plating on a polymer core particle with insulation

Au/Ni plating on a polymer core particle with insulation

Particle diameter (μmΦ)

4

3

Insulation coated particle

Yes

Yes

ACF Laminating conditions

Temperature (°C) *4

60 to 80

60 to 80

Time (sec) *5

1 to 2

1 to 2

Pressure (MPa) *6

0.3 to 1.0

0.3 to 1.0

Main bonding conditions

Temperature (°C) *4

190 to 230

190 to 230

Time (sec) *5

5

5

Pressure (MPa) *7

60 to 80

60 to 80

*1Minimum space: Space between neighboring circuits.

*2Minimum pitch: Total length of conductor width and space between neighboring circuits.

*3Minimum connection area: A contact area which needs to trap at least three particles (average -4.5δ) and where the faced conductor overlaps.

*4Temperature of ACF lamination and main bonding: It is not equipment temperature, but temperature of ACF.

*5Time of ACF lamination and main bonding: Time from the start of bonding to the point where the temperature reaches the target.

*6Pressure of ACF lamination: It is described as the area of ACF lamination.

*7Pressure of main bonding: The pressure at COG mounting is described as the total area of bumps. The pressure at FOG, FOB, and FOF mounting is described as the bonding area.

 

 

Interconnect a small-to-medium-sized LCD with an IC chip.

 

 


 

Note on the characteristic data given - Data on the characteristics of the products described in this page based on the results of evaluations carried out by the company. This does not guarantee that the characteristics of the product conform with your usage environment. Before use, review the usage conditions based on evaluation data obtained from the equipment and substrates actually used.

 

 

供应商信息

海郑实业(上海)有限公司——中国电力行业综合商超 海郑实业是一家专注于电力产品并拟全球化运营的公司。 海郑实业是集研发、生产、销售、代理经销、技术咨询、信息服务为一体的上海市专精特新型企业,有着精湛的技术及深厚的科研功底,并致力研发绿色环保材质,与世界知名电力、化工材料制造商合作,为整个电力产业提供***的产品。 海郑定位为:中国电子电力、石油化工、矿山设备、太阳能行业及风能行业一家大型综合提供整合方案的服务商。 海郑实业服务范围及解决方案:电力电缆组件(新能源节能环保方向)——船舶/矿业/电力电缆组件解决方案。 提供中高压电缆附件、电力电缆附件、矿用电力电缆组件、传统冷缩电缆附件、绝缘防腐涂料、防火防爆盒、风电及光伏发电应用、防水绝缘防火胶带、智能电缆在线监测、耐热增容导线、电缆修复材料、传感器等用胶、矿用电力设备、电缆附件、电缆在线监测、防火防水、电缆组件密封绝缘、矿用电缆组件、船舶电缆组件、中海油海上钻井平台电缆组件、冷缩电缆户内、户外和中间接头产品的全系列电力行业解决方案。

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主营行业 环氧树脂电工胶带绝缘套管其他电工电器设备 经营模式 生产加工
注册资本 1000万人民币 公司注册时间 2009年
公司所在地 上海 上海 浦东新区 金湘路225弄11号2号楼禹洲燕海国际大厦1016室 企业类型 有限责任公司(自然人独资)
法定代表人 张明鹤 工商注册号 913101126855398330
主营产品或服务 电缆组件3M21311KV灌胶接头快速修复电缆
联系方式
张先生总裁
13761135753
海郑实业(上海)有限公司
21-64889179
21-64889379
上海 上海 浦东新区 金湘路225弄11号2号楼禹洲燕海国际大厦1016室
公司主页http://www.seazheng.cn
上海 上海 上海 上海 浦东新区 金湘路225弄11号2号楼禹洲燕海国际大厦1016室 海郑实业(上海)有限公司
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